Skip navigation
Home
Browse
Communities
& Collections
Browse Items by:
Issue Date
Author
Title
Subject
Help
Sign on to:
My UniMAP Library Digital Repository
Receive email
updates
Edit Profile
UniMAP Library Digital Repository
JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
UniMAP Library Digital Repository
Search
Search:
All of UniMAP Library Digital Repository
Researchers
Azmi Kamardin
for
Current filters:
Title
Author
Subject
Date Issued
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Start a new search
Add filters:
Use filters to refine the search results.
Title
Author
Subject
Date Issued
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Results 1-2 of 2 (Search time: 0.0 seconds).
previous
1
next
Item hits:
Issue Date
Title
Author(s)
2013
The thermal expansion behaviors of Cu-SiCp composites
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
azmikamardin@unimap.edu.my
;
nazree@unimap.edu.my
;
mustafa_albakri@unimap.edu.my
Jan-2014
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
Sandu, A.V.
;
azmikamardin@unimap.edu.my
Discover
Author
2
Azmi, Kamardin
2
Mohd Mustafa Al-Bakri, Abdullah
2
Mohd Nazree, Derman, Dr.
1
Sandu, A.V.
Subject
2
Copper matrix composites
2
Electroless copper
2
Thermal expansion
1
Packaging materials
1
Porosity
.
next >
Date issued
1
2014
1
2013