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Issue Date
Title
Author(s)
2014
Cu-SiCp composites as advanced electronic packaging materials
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al Bakri, Abdullah
;
Sandu, A.V.
;
azmikamardin@unimap.edu.my
Jan-2014
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
Sandu, A.V.
;
azmikamardin@unimap.edu.my
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Author
2
Azmi, Kamardin
2
Mohd Nazree, Derman, Dr.
1
Mohd Mustafa Al Bakri, Abdullah
1
Mohd Mustafa Al-Bakri, Abdullah
Subject
2
Electroless copper
1
Copper matrix composites
1
Electronic packaging materials
1
Metal matrix composite (MMC)
1
Silicon carbide particles
.
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Date issued
2
2014