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Issue Date
Title
Author(s)
2013
The thermal expansion behaviors of Cu-SiCp composites
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
azmikamardin@unimap.edu.my
;
nazree@unimap.edu.my
;
mustafa_albakri@unimap.edu.my
Jan-2014
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
Sandu, A.V.
;
azmikamardin@unimap.edu.my
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Author
2
Azmi, Kamardin
2
Mohd Nazree, Derman, Dr.
1
Sandu, A.V.
Subject
2
Copper matrix composites
2
Electroless copper
2
Silicon carbide particles
2
Thermal expansion
1
Packaging materials
.
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Date issued
1
2014
1
2013