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Issue Date
Title
Author(s)
Nov-2013
Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
Ho, Li Ngee, Dr.
;
Teng, Fei Wu
;
Hiroshi, Nishikawa
;
holingee@yahoo.com
;
lnho@unimap.edu.my
;
nisikawa@jwri.osaka-u.ac.jp
Sep-2014
Copper-filled electrically conductive adhesives with enhanced shear strength
Ho, Li Ngee, Dr.
;
Hiroshi, Nishikawa
;
lnho@unimap.edu.my
;
nisikawa@jwri.osaka-u.ac.jp
Sep-2012
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
Ho, Li Ngee
;
Nishikawa, Hiroshi
;
holingee@yahoo.com
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Author
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Hiroshi, Nishikawa
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Ho, Li Ngee, Dr.
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Ho, Li Ngee
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Nishikawa, Hiroshi
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Teng, Fei Wu
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Subject
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Conductive adhesive
2
Copper
2
Shear strength
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Conductive adhesives
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Coupling agents
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Date issued
1
2014
1
2013
1
2012