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Issue Date
Title
Author(s)
Sep-2014
Copper-filled electrically conductive adhesives with enhanced shear strength
Ho, Li Ngee, Dr.
;
Hiroshi, Nishikawa
;
lnho@unimap.edu.my
;
nisikawa@jwri.osaka-u.ac.jp
Sep-2012
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
Ho, Li Ngee
;
Nishikawa, Hiroshi
;
holingee@yahoo.com
1-Dec-2009
Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
Li-Ngee, Ho
;
Hiroshi, Nishikawa
;
Tadashi, Takemoto
;
holingee@yahoo.com
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Author
2
Hiroshi, Nishikawa
1
Ho, Li Ngee
1
Ho, Li Ngee, Dr.
1
Li-Ngee, Ho
1
Nishikawa, Hiroshi
.
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Subject
3
Conductive adhesive
2
Electrical resistivity
1
Aging
1
Electrical properties
1
Metallic fillers
.
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Date issued
1
2014
1
2012
1
2009