Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37110
Title: Analysis of the heat transfer process inside a Lemang oven using computational fluid dynamics (CFD)
Authors: Nurul Fariza, Mohamed Elias
Suhaila Hussain
Keywords: Lemang
Lemang oven
Lemang stalk
Heat transfer
Issue Date: May-2010
Publisher: Universiti Malaysia Perlis (UniMAP)
Abstract: Experimental testing is carried out to discover the temperatures at the certain oven surface at the certain times. This steps required because to compare the result of analysis by using CFD with the experimental result. Then both answers will be comparing whether it’s approximately to the related theoretical result. The simulation will run by analysis the heat transfer by using Computational Fluid Dynamics (CFD) software. The drawing of 3-dimension of oven was done by using IRONCad software. Then, the drawing of 2-dimension must do in GAMBIT software by assemble the application of vertex, edge and face. Then, the meshing steps will be required to simulate what happening inside oven. CFD analysis was done to simulate what happened inside an oven during lemang cooking. The simulation events simulate that the real condition including contour of temperature, contour of velocity affected by fan, conduction and convection heat transfer. Radiative heat transfer was not including because it was not studied due to time constraint even though the various radioactive model is available in Fluent. In order to simulate the conductive inside the oven as exact as possible, the various models inside CFD software were studied and the most appropriate was closed. In order to validate the finding of the CFD simulation, certain properties where compared with experiment data and show how the accuracy of the CFD simulation done. The properties compared are temperature of the wall oven during lemang cooking.
Description: Access is limited to UniMAP community.
URI: http://dspace.unimap.edu.my:80/dspace/handle/123456789/37110
Appears in Collections:School of Manufacturing Engineering (FYP)

Files in This Item:
File Description SizeFormat 
Abstract, Acknowledgement.pdf110.36 kBAdobe PDFView/Open
Introduction.pdf186.41 kBAdobe PDFView/Open
Literature review.pdf594.82 kBAdobe PDFView/Open
Methodology.pdf331.31 kBAdobe PDFView/Open
Results and discussion.pdf210.58 kBAdobe PDFView/Open
Conclusion.pdf98.7 kBAdobe PDFView/Open
References and appendix.pdf78.18 kBAdobe PDFView/Open


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