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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/36079
Title: | Epoxy -recycled copper (e-recop) as thermoforming mold materials |
Authors: | Teh Pei Leng, Dr. |
Keywords: | International Invention, Innovation & Technology Exhibition (ITEX'14) Mold materials Termoforming mold Recycle copper Low cost mold |
Issue Date: | May-2014 |
Publisher: | Universiti Malaysia Perlis (UniMAP) |
Series/Report no.: | 25th International Invention, Innovation & Technology Exhibition;ITEX'14 |
Abstract: | • Rigidity and conductivity of metal thermoforming mold is better but it is expensive in term of fabrication process and material; E-REGOP mold is fabricated using simple, fast fabrication method. Lower material cost and it is able to fabricate in house. • Recycle copper is chosen due to its properties are almost equivalent to the virgin copper and low in cost. As compared to virgin copper, recycled copper can help in reduce the production cost of the mold material and still provide the equivalent properties as virgin copper. • Using recycled copper is more environmental friendly compared to a newly mined copper, which the mining and refining process of newly mined copper can cause pollution in the mother earth. |
Description: | Received a Silver medal in 25th International Invention, Innovation & Technology Exhibition (ITEX'14), 8th-10th May at Kuala Lumpur Convention Centre. |
URI: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/36079 |
Appears in Collections: | Universiti Malaysia Perlis |
Files in This Item:
File | Description | Size | Format | |
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EPOXY-RECYCLED.pdf | 1.35 MB | Adobe PDF | View/Open |
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