Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35718
Title: Corn cob filled chitosan biocomposite films
Authors: Chan, Ming Yeng
Salmah, Husseinsyah, Prof. Madya Ir. Dr.
Sam, Sung Ting, Dr.
chanmingyeng@hotmail.my
irsalmah@unimap.edu.my
stsam@unimap.edu.my
Keywords: Biocomposite
Chitosan
Corn cob
Films
Issue Date: 2013
Publisher: Trans Tech Publications
Citation: Advanced Materials Research, vol. 747, 2013, pages 649-652
Abstract: Recently, there has been renews interest in chitosan as materials in producing of biocomposite films. The chitosan (CS)/corn cob (CC) biocomposite films were prepared by solvent casting method. The effect of CC content on tensile properties of CS/CC biocomposite films was studied. The tensile strength and elongation at break of CS/CC biocomposite films decreased as increasing of CC content. However, the increasing of CC content was increased the tensile modulus of CS/CC biocomposite films. Scanning electron microscopy (SEM) was indicated that the deceasing of tensile properties was due to the poor interfacial adhesion between CC filler and CS matrix.
Description: Link to publisher's homepage at http://www.ttp.net/
URI: http://www.scientific.net/AMR.747.649
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35718
ISBN: 978-303785771-7
ISSN: 1022-6680
Appears in Collections:Sam Sung Ting, Assoc. Prof. Ts. Dr.
School of Bioprocess Engineering (Articles)
School of Materials Engineering (Articles)
Salmah Husseinsyah, Assoc. Prof. Ir. Dr.

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