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dc.contributor.authorChan, Ming Yeng-
dc.contributor.authorSalmah, Husseinsyah, Prof. Madya Ir. Dr.-
dc.contributor.authorSam, Sung Ting, Dr.-
dc.date.accessioned2014-06-19T08:49:14Z-
dc.date.available2014-06-19T08:49:14Z-
dc.date.issued2013-11-
dc.identifier.citationPolymer - Plastics Technology and Engineering, vol. 52(14), 2013, pages 1496-1502en_US
dc.identifier.issn0360-2559-
dc.identifier.urihttp://www.tandfonline.com/doi/abs/10.1080/03602559.2013.820752#.U6Khv5SSyyo-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35717-
dc.descriptionLink to publisher's homepage at http://www.tandfonline.com/en_US
dc.description.abstractThe present work was investigated the effect of filler content and chemical modification on mechanical, thermal properties and morphology study of CS/CC biocomposite films. The acrylic acid was used as chemical modification of corn cob. The increasing of CC content has decreased the tensile strength and elongation at break, but increased the modulus of elasticity of CS/CC biocomposite films. The modified corn cob with acrylic acid (AA) has enhanced the tensile properties and thermal properties of CS/CC biocomposite films by improving the interfacial interaction. The chemical reaction between acrylic acid and corn cob was confirmed by Fourier transmission infrared (FTIR) and the improvement of interfacial bonding was proven by scanning electron microscopy.en_US
dc.language.isoenen_US
dc.publisherTaylor and Francis Group, LLC.en_US
dc.subjectAcrylic aciden_US
dc.subjectBiocompositeen_US
dc.subjectChitosanen_US
dc.subjectCorn coben_US
dc.subjectFilmsen_US
dc.titleModified corn cob filled chitosan biocomposite filmsen_US
dc.typeArticleen_US
dc.contributor.urlirsalmah@unimap.edu.myen_US
dc.contributor.urlstsam@unimap.edu.myen_US
Appears in Collections:Sam Sung Ting, Assoc. Prof. Ts. Dr.
Salmah Husseinsyah, Assoc. Prof. Ir. Dr.
School of Materials Engineering (Articles)
School of Bioprocess Engineering (Articles)

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