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DC Field | Value | Language |
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dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | - |
dc.contributor.author | Somidin, Flora | - |
dc.contributor.author | Nik Noriman, Zulkepli, Dr. | - |
dc.contributor.author | Khairel Rafezi, Ahmad, Dr. | - |
dc.contributor.author | Mayappan, Ramani | - |
dc.contributor.author | Noor Farhani, Mohd Alui | - |
dc.date.accessioned | 2014-05-29T01:58:04Z | - |
dc.date.available | 2014-05-29T01:58:04Z | - |
dc.date.issued | 2013 | - |
dc.identifier.citation | Advanced Materials Research, vol.795, 2013, pages 451-454 | en_US |
dc.identifier.isbn | 978-303785811-0 | - |
dc.identifier.issn | 1022-6680 (Print) | - |
dc.identifier.issn | 1662-8985 (Online) | - |
dc.identifier.uri | http://www.scientific.net/AMR.795.451 | - |
dc.identifier.uri | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34846 | - |
dc.description | Link to publisher's homepage at http://www.ttp.net/ | en_US |
dc.description.abstract | Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt. % re-Al) particulates produced from aluminium beverage cans were successfully fabricated via powder metallurgy techniques in this study. This paper focuses on the thermal properties focusing on the melting temperature of the new developed Sn-0.7Cu/re-Al lead-free composite solder. The melting temperature (Tm) of the new solders was determined using differential scanning calorimetry (DSC). The melting temperature of the composite solders has showed comparable results with the monolithic solders of Sn-0.7Cu lead-free solder. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Trans Tech Publications | en_US |
dc.subject | Lead-free composite solder | en_US |
dc.subject | Melting temperature | en_US |
dc.subject | Recycled-Aluminium | en_US |
dc.title | Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder | en_US |
dc.type | Article | en_US |
dc.identifier.url | 10.4028/www.scientific.net/AMR.795.451 | - |
dc.contributor.url | arifanuar@unimap.edu.my | en_US |
dc.contributor.url | niknoriman@unimap.edu.my | en_US |
dc.contributor.url | rafezi@unimap.edu.my | en_US |
dc.contributor.url | ramani@perlis.uitm.edu.my | en_US |
Appears in Collections: | Nik Noriman Zulkepli, Assoc. Prof. Ts. Dr. Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. |
Files in This Item:
File | Description | Size | Format | |
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Thermal properties of Sn07CureAl composite leadfree solder.pdf | 136.16 kB | Adobe PDF | View/Open |
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