UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
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Statistics
Total Visits
| Views | |
|---|---|
| Cu-SiCp composites as advanced electronic packaging materials | 260 |
Total Visits per Month
| October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | |
|---|---|---|---|---|---|---|---|
| Cu-SiCp composites as advanced electronic packaging materials | 11 | 3 | 14 | 10 | 7 | 11 | 4 |
File Downloads
| Views | |
|---|---|
| Cu-SiCp composites as advanced electronic packaging materials.pdf | 49 |
Top Country Views
| Views | |
|---|---|
| United States | 134 |
| China | 18 |
| Ireland | 17 |
| Russia | 11 |
| Sweden | 9 |
| Germany | 6 |
| Finland | 6 |
| Senegal | 6 |
| Japan | 5 |
| Malaysia | 5 |
Top City Views
| Views | |
|---|---|
| San Mateo | 22 |
| Mountain View | 20 |
| Dublin | 17 |
| Boardman | 9 |
| Hangzhou | 8 |
| Ashburn | 3 |
| Des Moines | 3 |
| Hanoi | 3 |
| Andover | 2 |
| Beijing | 2 |