UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
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Statistics
Total Visits
| Views | |
|---|---|
| Cu-SiCp composites as advanced electronic packaging materials | 182 |
Total Visits per Month
| January 2024 | February 2024 | March 2024 | April 2024 | May 2024 | June 2024 | July 2024 | |
|---|---|---|---|---|---|---|---|
| Cu-SiCp composites as advanced electronic packaging materials | 17 | 4 | 1 | 2 | 6 | 14 | 5 |
File Downloads
| Views | |
|---|---|
| Cu-SiCp composites as advanced electronic packaging materials.pdf | 34 |
Top Country Views
| Views | |
|---|---|
| United States | 93 |
| Ireland | 17 |
| China | 9 |
| Russia | 9 |
| Sweden | 9 |
| Finland | 6 |
| Senegal | 6 |
| Malaysia | 5 |
| Germany | 3 |
| Vietnam | 3 |
Top City Views
| Views | |
|---|---|
| Mountain View | 18 |
| Dublin | 17 |
| Boardman | 7 |
| Hangzhou | 6 |
| San Mateo | 4 |
| Des Moines | 3 |
| Hanoi | 3 |
| Dakar | 2 |
| Kuala Lumpur | 2 |
| Odesa | 2 |