UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
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Statistics
Total Visits
| Views | |
|---|---|
| Cu-SiCp composites as advanced electronic packaging materials | 461 |
Total Visits per Month
| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
|---|---|---|---|---|---|---|---|
| Cu-SiCp composites as advanced electronic packaging materials | 59 | 43 | 6 | 14 | 52 | 13 | 13 |
File Downloads
| Views | |
|---|---|
| Cu-SiCp composites as advanced electronic packaging materials.pdf | 56 |
Top Country Views
| Views | |
|---|---|
| United States | 300 |
| China | 25 |
| Ireland | 17 |
| Russia | 11 |
| Sweden | 9 |
| Brazil | 8 |
| Japan | 8 |
| Germany | 6 |
| Finland | 6 |
| United Kingdom | 6 |
Top City Views
| Views | |
|---|---|
| San Mateo | 111 |
| Mountain View | 20 |
| Dublin | 17 |
| Boardman | 9 |
| Hangzhou | 8 |
| Ashburn | 4 |
| Beijing | 4 |
| Buffalo | 4 |
| Des Moines | 3 |
| Hanoi | 3 |