Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34430
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dc.contributor.authorOng, Hui Lin, Dr.-
dc.contributor.authorZainal Arifin, Mohd Ishak-
dc.contributor.authorHazizan, Md Akil-
dc.date.accessioned2014-05-15T07:52:15Z-
dc.date.available2014-05-15T07:52:15Z-
dc.date.issued2009-
dc.identifier.citationMaterials and Design, vol. 30(3), 2009, pages 748-751en_US
dc.identifier.issn0261-3069-
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S0261306908001933-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34430-
dc.descriptionLink to publisher's homepage at http://www.sciencedirect.com/en_US
dc.description.abstractNanosilica-filled polypropylene composites, containing 1, 2, 3, 4 and 5 wt% of fumed silica nanoparticles were prepared using a thermo Haake internal mixer. Polypropylene-methyl polyhedral oligomeric silsesquioxane (PP-methyl POSS) was introduced into the system as a compatibiliser. The composites were characterized by performing tensile and impact testing as well as SEM analysis. From the mechanical test results, it was found that PP-methyl POSS was effectively enhanced the tensile properties of the composites at lower nanosilica content. The enhancement of the properties of nanosilica-filled polypropylene composites was attributed to a better dispersion of nanosilica and increased compatibility between silica and polypropylene matrix with the presence of PP-methyl POSS as compatibiliser.en_US
dc.language.isoenen_US
dc.publisherElsevier Ltd.en_US
dc.subjectMechanical propertiesen_US
dc.subjectNanosilica-filled polypropyleneen_US
dc.subjectPP-methyl POSSen_US
dc.titlePreparation and properties of nanosilica-filled polypropylene composites with PP-methyl POSS as compatibiliseren_US
dc.typeArticleen_US
dc.identifier.urlhttp://dx.doi.org/10.1016/j.matdes.2008.05.007-
dc.contributor.urlhlong@unimap.edu.myen_US
dc.contributor.urlzarifin@eng.usm.myen_US
dc.contributor.urlhazizan@eng.usm.myen_US
Appears in Collections:Ong Hui Lin, Assoc. Prof. Dr.



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