Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34371
Full metadata record
DC FieldValueLanguage
dc.contributor.authorNur Athirah, Mat Nawi-
dc.contributor.authorA.R. Abdullah-
dc.contributor.authorMohd Afendi, Rojan, Dr.-
dc.contributor.authorMohd Shukry, Abdul Majid, Dr.-
dc.contributor.authorRuslizam, Daud, Dr.-
dc.contributor.authorHaftirman, Idrus, Dr.-
dc.date.accessioned2014-05-08T08:16:51Z-
dc.date.available2014-05-08T08:16:51Z-
dc.date.issued2014-
dc.identifier.citationKey Engineering Materials, vol.594-595, 2014, pages 930-934en_US
dc.identifier.issn1662-9795-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34371-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractA two-dimensional adhesively bonded dissimilar single lap joint model was analyzed under tension. An explicit closed-form solution was formulated by using MATLAB tool for analysis of shear and peel stresses distribution along the bondline under effect of variation of overlap length, adherend thickness ratio and adherend Youngs modulus ratio. The solution was formulated based on analysis of Bo Zhao et al. [2]. The bending moment at the edge joint of the Bo Zhaos solution was replaced by the bending moment at the edge joint that have been proposed by X. Zhao et al. [5] to compare the accuracy of solutions. The least stress intensities in dissimilar joint could be achieved with a suitable ratio of thickness and Youngs modulus of adherends.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectAdhesiveen_US
dc.subjectClosed-Formen_US
dc.subjectDissimilar jointen_US
dc.subjectFinite Element Method (FEM)en_US
dc.subjectSingle lapen_US
dc.titleNumerical stress analysis of epoxy adhesively bonded dissimilar jointen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/KEM.594-595.930-
dc.identifier.doi10.4028/www.scientific.net/KEM.594-595.930-
dc.contributor.urlnurathirah_matnawi@gmail.comen_US
Appears in Collections:Ruslizam Daud, Assoc Prof. Ir. Dr.
Mohd Shukry Abdul Majid, Assoc. Prof. Ir. Dr.
Haftirman Idrus, Dr.
Mohd Afendi Bin Rojan, Associated Professor Dr.
School of Mechatronic Engineering (Articles)

Files in This Item:
File Description SizeFormat 
Numerical stress analysis of epoxy adhesively bonded dissimilar joint.pdf133.17 kBAdobe PDFView/Open


Items in UniMAP Library Digital Repository are protected by copyright, with all rights reserved, unless otherwise indicated.