Please use this identifier to cite or link to this item:
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/33943
Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Goh, Teck Joo | - |
dc.contributor.author | Chiu, Chiapin | - |
dc.contributor.author | Seetharamu, Kankanhally N. | - |
dc.contributor.author | Ghulam, Abdul Quadir, Prof. Dr. | - |
dc.contributor.author | Zainal Alimuddin, Zainal Alauddin, Dr. | - |
dc.date.accessioned | 2014-04-23T04:38:24Z | - |
dc.date.available | 2014-04-23T04:38:24Z | - |
dc.date.issued | 2006 | - |
dc.identifier.citation | Microelectronics International, vol. 23(2), 2006, pages 3-10 | en_US |
dc.identifier.issn | 1356-5362 | - |
dc.identifier.uri | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943 | - |
dc.description | Link to publisher's homepage at http://www.emeraldinsight.com/ | en_US |
dc.description.abstract | Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined and the design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. The design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also explained. Findings: Describes the design considerations and processes of the package substrate and printed-circuit board with special emphasis on the physical routing of the thermal test chip structures. These design processes are supported with thermal data from various finite-element analyses carried out to evaluate the capability and limitations of thermal test vehicle design. Originality/value: The validation and calibration procedures of a thermal test vehicle are presented in this paper. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Emerald Group Publishing Limited | en_US |
dc.subject | Finite element analysis | en_US |
dc.subject | Printed circuits | en_US |
dc.subject | Tests and testing | en_US |
dc.subject | Thermal testing | en_US |
dc.title | Test chip and substrate design for flip chip microelectronic package thermal measurements | en_US |
dc.type | Article | en_US |
dc.identifier.url | http://dx.doi.org/10.1108/13565360610669959 | - |
dc.identifier.url | http://www.emeraldinsight.com/journals.htm?articleid=1550663 | - |
dc.contributor.url | teck.joo.goh@intel.com | en_US |
dc.contributor.url | knseetharamu@hotmail.com | en_US |
dc.contributor.url | gaquadir@unimap.edu.my | en_US |
Appears in Collections: | Ghulam Abdul Quadir, Prof. Dr. |
Files in This Item:
File | Description | Size | Format | |
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Test chip and substrate design for flip chip microelectronic package thermal measurements.pdf | 57.93 kB | Adobe PDF | View/Open |
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