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Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 119 |
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Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 2 | 0 | 0 | 7 | 22 | 13 | 6 |
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Results and discussion.pdf | 3 |
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Abstract, Acknowledgement.pdf | 1 |
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