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Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application 119

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Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application 2 0 0 7 22 13 6

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Results and discussion.pdf 3
Introduction.pdf 3
Referrences and Appendix.pdf 1
Conclusion.pdf 1
Methodology.pdf 1
Literature review.pdf 1
Abstract, Acknowledgement.pdf 1

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