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dc.contributor.authorHo, Li Ngee, Dr.-
dc.contributor.authorTeng, Fei Wu-
dc.contributor.authorHiroshi, Nishikawa-
dc.date.accessioned2014-03-28T03:59:26Z-
dc.date.available2014-03-28T03:59:26Z-
dc.date.issued2013-11-
dc.identifier.citationJournal of Adhesion, vol. 89(11), 2013, pages 847-858en_US
dc.identifier.issn0021-8464-
dc.identifier.urihttp://www.tandfonline.com/doi/abs/10.1080/00218464.2013.775039#.UzTyZaiSyyo-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33189-
dc.descriptionLink to publisher's homepage at www.taylorandfrancisgroup.com/‎en_US
dc.description.abstractIn this study, a phenolic-based Ag flake-filled electrically conductive adhesive (ECA) was investigated in terms of rheological, electrical, and mechanical properties. To clarify the effect of various Ag flake filler content and silane coupling agents on the characteristic of the ECA, rheological properties of the Ag flake-filled ECA paste, electrical resistivity, and shear strength of the cured ECA were investigated. Results showed that an increase of Ag flake content leads to an increase in both viscosity of the ECA paste and electrical conductivity of the as-cured ECA. Silane coupling agents-treated Ag flakes have a significant effect on the electrical resistivity and shear strength in the ECAs.en_US
dc.language.isoenen_US
dc.publisherTaylor and Francis Group, LLC.en_US
dc.subjectConductive adhesivesen_US
dc.subjectCoupling agentsen_US
dc.subjectElectrical resistivityen_US
dc.subjectRheologyen_US
dc.subjectShear strengthen_US
dc.titleProperties of phenolic-based Ag-filled conductive adhesive affected by different coupling agentsen_US
dc.typeArticleen_US
dc.contributor.urlholingee@yahoo.comen_US
dc.contributor.urllnho@unimap.edu.myen_US
dc.contributor.urlnisikawa@jwri.osaka-u.ac.jpen_US
Appears in Collections:Ho Li Ngee, Dr.
School of Materials Engineering (Articles)

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