Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/33169
Title: Current trend in simulation: A study simulation of Poly-Silicon nanowire using COMSOL multiphysics
Authors: Uda, Hashim, Prof. Dr.
M. Wesam, Al-Mufti
Tijjani Adam, Shuwa
uda@unimap.edu.my
mohamenw@gmail.com
tijjaniadam@yahoo.com.my
Keywords: COMSOL Multiphysics
Nanostructure
Poly-Si nanowire
Thermoelectric device
Issue Date: 2013
Publisher: Trans Tech Publications
Citation: Advanced Materials Research, vol. 795, 2013, pages 669-673
Abstract: Poly-Silicon nanowire (Poly-Si-NW) simulations are very important field of nanotechnology and nanostructures; in this paper presented review in general nanowire and it applications such as thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting and many more applications in this field.COMSOL multiphysics is one of programmers using for nanotechnology and nanowires simulation, hence in this review paper, COMSOL simulation with different types of materials using for nanowire and other structures. Also In this work, we explore the effect of the electrical contact resistance on the performance of a TED. COMSOL simulations are performed on Poly-SiNW to investigate such effects on its cooling performance. Intrinsically, Poly-SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance
Description: Link to publisher's homepage at http://www.ttp.net/
URI: http://www.scientific.net/AMR.795.669
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33169
ISBN: 978-303785811-0
ISSN: 1022-6680
Appears in Collections:Institute of Nano Electronic Engineering (INEE) (Articles)
Uda Hashim, Prof. Ts. Dr.



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