UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Statistics
Total Visits
| Views | |
|---|---|
| Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | 161 |
Total Visits per Month
| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
|---|---|---|---|---|---|---|---|
| Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | 4 | 2 | 0 | 3 | 16 | 10 | 10 |
File Downloads
| Views | |
|---|---|
| Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging.pdf | 85 |
Top Country Views
| Views | |
|---|---|
| United States | 69 |
| China | 18 |
| Finland | 8 |
| Ireland | 8 |
| Brazil | 6 |
| Sweden | 6 |
| Australia | 4 |
| Germany | 4 |
| Vietnam | 4 |
| Hong Kong | 3 |
Top City Views
| Views | |
|---|---|
| San Mateo | 14 |
| Dublin | 8 |
| Boardman | 7 |
| Hanoi | 3 |
| Amsterdam | 2 |
| Andover | 2 |
| Ashburn | 2 |
| Beijing | 2 |
| Buffalo | 2 |
| Hangzhou | 2 |