UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
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Statistics
Total Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 202 |
Total Visits per Month
| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
|---|---|---|---|---|---|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 3 | 6 | 3 | 3 | 2 | 5 | 4 |
File Downloads
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging.pdf | 6 |
Top Country Views
| Views | |
|---|---|
| United States | 99 |
| China | 13 |
| Finland | 12 |
| Russia | 12 |
| Germany | 10 |
| Ireland | 8 |
| Singapore | 6 |
| Brazil | 5 |
| Malaysia | 5 |
| Sweden | 5 |
Top City Views
| Views | |
|---|---|
| Mountain View | 20 |
| San Mateo | 18 |
| Dublin | 8 |
| Boardman | 6 |
| Ashburn | 3 |
| Hanoi | 3 |
| Kuala Lumpur | 3 |
| Singapore | 3 |
| Chicago | 2 |
| Los Angeles | 2 |