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Issue Date
Title
Author(s)
2005
Application of artificial neural network for fatigue life prediction
Ishak, Abdul Azid, Dr.
;
Lee, Kor Oon
;
Ong, Kang E.
;
Seetharamu, Kankanhally N.
;
Ghulam, Abdul Quadir, Prof. Dr.
;
ishak@eng.usm.my
;
leekoroon@yahoo.com
;
oku337@hotmail.com
;
knramu@eng.usm.my
;
gaquadir@unimap.edu.my
2006
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
Lee, Kor Oon
;
Ong, Kang E.
;
Seetharamu, Kankanhally N.
;
Ishak, Abdul Azid, Dr.
;
Ghulam, Abdul Quadir, Prof. Dr.
;
Goh, Teck Joo
;
ishak@eng.usm.my
;
gaquadir@unimap.edu.my
2005
Optimization of fins used in electronic packaging
Ong, Kang Eu
;
Lee, Kor Oon
;
Seetharamu, Kankanhally N.
;
Ishak, Abdul Azid, Dr.
;
Ghulam, Abdul Quadir, Prof. Dr.
;
Zainal Alimuddin, Zainal Alauddin, Dr.
;
Goh, Teck Joo
;
leekoroon@yahoo.com
;
knseetharamu@hotmail.com
;
ishak@eng.usm.my
;
gaquadir@unimap.edu.my
Discover
Author
3
Ghulam, Abdul Quadir, Prof. Dr.
3
Ishak, Abdul Azid, Dr.
3
Seetharamu, Kankanhally N.
2
Goh, Teck Joo
2
Ong, Kang E.
.
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Subject
1
Artificial neural network
1
Electronics industry
1
Finite element simulation
1
Heat transfer
1
Joining materials
.
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Date issued
1
2006
2
2005