1. UniMAP Library Digital Repository

Search


Current filters:
Start a new search
Add filters:

Use filters to refine the search results.

 | 
Results 1-7 of 7 (Search time: 0.0 seconds).
  • previous
  • 1
  • next
Item hits:
Issue DateTitleAuthor(s)
2003Flip chip thermal test vehicle design: Requirements, evaluations, and validationsGoh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2006Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue lifeLee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Goh, Teck Joo; ishak@eng.usm.my; gaquadir@unimap.edu.my
2004Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimizationGoh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan; teck.joo.goh@intel.com; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2004Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approachGoh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2006Test chip and substrate design for flip chip microelectronic package thermal measurementsGoh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; teck.joo.goh@intel.com; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2003Fast transient solutions for heat transfer [FEM]Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2005Optimization of fins used in electronic packagingOng, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo; leekoroon@yahoo.com; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my

Discover