Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/32783
Title: Effect of process parameters on the cooling performance of liquid cooling system for electronic application
Authors: Wan Mohd Arif, Wan Ibrahim
Yeoh, Cheow Keat, Dr.
Teh, Pei Leng, Dr.
Noorina Hidayu, Jamil
wanarif@unimap.edu.my
ckyeoh@unimap.edu.my
plteh@unimap.edu.my
noorinahidayu@unimap.edu.my
Keywords: Heat flux
Heat transfer coefficient
Input power
Mass flow rate
Thermal resistance
Issue Date: 2013
Publisher: Trans Tech Publications
Citation: Advanced Materials Research, vol. 795, 2013, pages 591-596
Abstract: This project is focused to study on the cooling performance of liquid cooling system under different process parameter. In this research, a liquid cooling system with copper block that simulates CPU, was setup to identify cooling performance of distilled water and vegetable oil at different mass flow rates (distilled water: 8.00g/s, 10.60g/s & 13.24g/s; vegetable oil: 1.22g/s, 1.30g/s & 1.38g/s) and input power (29.12W & 47.66W). The cooling performance of each fluid was characterized by the properties of: heat transfer coefficient, thermal resistance and also, the maximum CPU temperature (T4 at 66min) for the experiments. Experimental data shows that cooling performance was improved at higher mass flow rate and both distilled water and vegetable oil is a good coolant material.
Description: Link to publisher's homepage at http://www.ttp.net/
URI: http://www.scientific.net/AMR.795.591
http://dspace.unimap.edu.my:80/dspace/handle/123456789/32783
ISBN: 978-303785811-0
ISSN: 1022-6680
Appears in Collections:Wan Mohd Arif Wan Ibrahim, Ts.
Noorina Hidayu Jamil, Madam
Yeoh, Cheow Keat, Assoc. Prof. Ir. Dr.
Teh Pei Leng, Associate Professor Dr.
School of Materials Engineering (Articles)



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