Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/30496
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dc.contributor.authorM. N. F., Pargi-
dc.contributor.authorTeh, Pei Leng, Dr.-
dc.contributor.authorSalmah, Husseinsyah, Prof. Madya Ir. Dr.-
dc.contributor.authorYeoh, Cheow Keat, Dr.-
dc.date.accessioned2013-12-12T08:58:18Z-
dc.date.available2013-12-12T08:58:18Z-
dc.date.issued2012-06-18-
dc.identifier.citationp. 219 - 224en_US
dc.identifier.isbn978-967-5760-11-2-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/30496-
dc.descriptionThe 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Postgraduates Student Association Ireland (MyPSI), 18th - 19th June 2012 at Putra World Trade Center (PWTC), Kuala Lumpur, Malaysia.en_US
dc.description.abstractThermal, electrical and physical properties of the recycled copper filled epoxy composites were investigated. The recycled copper was collected as a waste from the milling machine. The recycled copper filled epoxy composite was fabricated using mechanical stirrer. The effect of volume fraction of recycled copper of the epoxy composites were studied based on the coefficient of thermal analysis (CTE), electrical conductivity and hardness. Incorporation of recycled copper has decreased the CTE of the composites. The higher the filler loading, the lower the CTE was observed. When the volume fraction of recycled copper increased, the electrical conductivity of the composites was increased. Hardness and density was increased with increasing of filler loading.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.relation.ispartofseriesProceedings of the The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012);-
dc.subjectRecycled copperen_US
dc.subjectEpoxyen_US
dc.subjectCoefficient of thermal expansion (CTE)en_US
dc.subjectElectrical conductivityen_US
dc.subjectHardnessen_US
dc.subjectDensityen_US
dc.titleThermal, electrical and physical properties of recycled copper filled epoxy compositesen_US
dc.typeWorking Paperen_US
dc.contributor.urlmoss_fuadi@yahoo.comen_US
dc.contributor.urlplteh@unimap.edu.myen_US
dc.contributor.urlirsalmah@unimap.edu.myen_US
dc.contributor.urlckyeoh@unimap.edu.myen_US
Appears in Collections:Conference Papers
Salmah Husseinsyah, Assoc. Prof. Ir. Dr.
Teh Pei Leng, Associate Professor Dr.
Yeoh, Cheow Keat, Assoc. Prof. Ir. Dr.

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