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Issue Date
Title
Author(s)
2013
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
Yap, Boon Kar, Dr.
;
Noor Azrina, Talik
;
Zaliman, Sauli, Dr.
;
Retnasamy, Vithyacharan
;
kbyap@uniten.edu.my
;
zaliman@unimap.edu.my
;
vc.sundres@gmail.com
2011
Temperature cycling analysis for ball grid array package using finite element analysis
Muhammad Nubli, Zulkifli
;
Zul Azhar, Zahid Jamal, Prof. Dr.
;
Ghulam, Abdul Quadir
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Author
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Ghulam, Abdul Quadir
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Muhammad Nubli, Zulkifli
1
Noor Azrina, Talik
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Retnasamy, Vithyacharan
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Yap, Boon Kar, Dr.
.
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Finite element analysis
1
ABAQUS
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Flip chip
1
Joining processes
1
Solder ball
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Date issued
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2013
1
2011