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Issue Date
Title
Author(s)
2014
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
Zaliman, Sauli, Dr.
;
Retnasamy, Vithyacharan
;
Aaron, Koay Terr Yeow
;
Wei Wei, Ng
;
vc.sundres@gmail.com
2014
Surface roughness analysis on reactive ion etched aluminium deposited wafer
Zaliman, Sauli, Dr.
;
Retnasamy, Vithyacharan
;
Aaron, Koay Terr Yeow
;
zaliman@unimap.edu.my
Jan-2014
Main effects study on plasma etched aluminium metallization
Zaliman, Sauli, Dr.
;
Retnasamy, Vithyacharan
;
Aaron, Koay Terr Yeow
;
zaliman@unimap.edu.my
Sep-2006
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
Mohd Khairuddin, Md Arshad
;
Ibrahim, Ahmad
;
Azman, Jalar
;
Ghazali, Omar
;
Uda, Hashim
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Author
3
Aaron, Koay Terr Yeow
3
Retnasamy, Vithyacharan
3
Zaliman, Sauli, Dr.
1
Azman, Jalar
1
Ghazali, Omar
.
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Subject
3
Reactive Ion Etching (RIE)
3
Surface roughness
2
Design of experiment (DOE)
1
DOE
1
Electroless nickel immersion gold...
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Date issued
3
2014
1
2006