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Results 1-10 of 48 (Search time: 0.0 seconds).
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Issue DateTitleAuthor(s)
29-Dec-2006Uninterruptible power supply monitoring system with Visual BasicSohiful Anuar, Zainol Murad; Mohd Nazrin, Md Isa; Norazeani, Abdul Rahman
2006The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) depositionMohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar
May-2007A simple oxidation technique for quantum dot dimension shrinkage and tunnel barriers generationMadnarski Sutikno; Uda, Hashim, Prof. Dr.; Zul Azhar, Zahid Jamal, Prof. Dr.
2007FPGA based SPWM Bridge InverterMohd Nazrin, Md Isa; Muhammad Imran, Ahmad; Sohiful Anuar, Zainol Murad; Mohd Khairuddin, Md Arshad
Mar-2008Core nucleus polarization in Λ hypernucleiUsmani, Q. N.; Bodmer, A. R.; Zaliman, Sauli
Jul-2009GaN Schottky barrier photodiode on Si (1 1 1) with low-temperature-grown cap layerChuah, Lee Siang; Z., Hassan; H., Abu Hassan; Naser Mahmoud, Ahmed
2007Under Bump Metallurgy (UBM)-a technology review for flip chip packagingMohd Khairuddin Md Arshad; Uda Hashim; Muzamir Isa
2007The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) depositionMohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar
Sep-2006The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold depositionMohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim
2007Effect of alignment mark architecture on alignment signal behavior in advanced lithographyNormah, Ahmad; Uda, Hashim; Mohd Jeffery, Manaf; Kader Ibrahim, Abdul Wahab

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