Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/24195
Title: Modular architecture of a non-contact pinch actuation micropump
Authors: Chee, Pei Song
Rashidah, Arsat. Dr.
Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Leow, Pei Ling
pschee2@live.utm.my
rashidah@fke.utm.my
tijjaniadam@yahoo.com
uda@unimap.edu.my
ruzairi@fke.utm.my
leowpl@fke.utm.my
Keywords: Diffuser
Electromagnetic micropump
Hot embossing
Lab on chip
Issue Date: Sep-2012
Publisher: MDPI, Basel, Switzerland.
Citation: Sensors (Switzerland), vol. 12 (9), 2012, pages 12572-12587
Abstract: This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz.
Description: Link to publisher's homepage http://www.mdpi.com/
URI: http://www.mdpi.com/1424-8220/12/9/12572
http://dspace.unimap.edu.my/123456789/24195
ISSN: 1424-8220
Appears in Collections:Institute of Nano Electronic Engineering (INEE) (Articles)
Uda Hashim, Prof. Ts. Dr.

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