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Issue Date
Title
Author(s)
2013
Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
Mazlan, Mohamed
;
A. Rahim
;
Mohd Mustafa Al-Bakri, Abdullah
;
Wan Yusra Hannanah, Wan Abdul Razak
;
Ahmad Faiz, Zubair
;
Y. M., Najib
;
A. Bakir, Azman
;
mazlan547@ppinang.uitm.edu.my
;
mustafa_albakri@unimap.edu.my
2013
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
Mazlan, Mohamed
;
A. Rahim
;
Mohd Mustafa Al-Bakri, Abdullah
;
Iqbal, M. A.
;
Wan Yusra Hannanah, Wan Abdul Razak
;
Mohammad Shahril, Salim
;
mazlan547@ppinang.uitm.edu.my
;
mustafa_albakri@unimap.edu.my
;
mshahril@unimap.edu.my
2013
The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
Mazlan, Mohamed
;
A. Rahim
;
Iqbal, M. A.
;
Mohd Mustafa Al Bakri, Abdullah
;
Wan Yusra Hannanah, Wan Abdul Razak
;
Mohd Sukhairi, Mat Rasat
;
mazlan547@ppinang.uitm.edu.my
;
mustafa_albakri@unimap.edu.my
;
sukhairi@umk.edu.my
2013
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
Mazlan, Mohamed
;
A. Rahim
;
Iqbal, M. A.
;
Mohd Mustafa Al Bakri, Abdullah
;
Wan Yusra Hannanah, Wan Abdul Razak
;
Mohd Nor Hakim, Hassan
;
mazlan547@ppinang.uitm.edu.my
;
mustafa_albakri@unimap.edu.my
Discover
Author
4
A. Rahim
4
Mazlan, Mohamed
3
Iqbal, M. A.
2
Mohd Mustafa Al Bakri, Abdullah
2
Mohd Mustafa Al-Bakri, Abdullah
.
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Subject
2
Microprocessors
2
Thermal Management
1
Average junction temperature
1
Computational Fluid Dynamic (CFD)
1
Epoxy Moulding Compound (EMC)
.
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Date issued
4
2013