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Issue Date
Title
Author(s)
2013
The thermal expansion behaviors of Cu-SiCp composites
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
azmikamardin@unimap.edu.my
;
nazree@unimap.edu.my
;
mustafa_albakri@unimap.edu.my
2013
Synthesis and characterization of electroless copper coated SiC particles
Azmi, Kamardin
;
Mohd Arif Anuar, Mohd Salleh
;
Mohd Nazree, Derman, Dr.
;
azmikamardin@unimap.edu.my
;
arifanuar@unimap.edu.my
;
nazree@unimap.edu.my
2014
Cu-SiCp composites as advanced electronic packaging materials
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al Bakri, Abdullah
;
Sandu, A.V.
;
azmikamardin@unimap.edu.my
Jan-2014
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
Azmi, Kamardin
;
Mohd Nazree, Derman, Dr.
;
Mohd Mustafa Al-Bakri, Abdullah
;
Sandu, A.V.
;
azmikamardin@unimap.edu.my
16-Mar-2010
Failure analysis on a ruptured petrochemical pipe
Mohd, Harun
;
Shaiful Rizam, Shamsudin
;
Azmi, Kamardin
;
mohd_harun@nuclearmalaysia.gov.my
Discover
Author
4
Mohd Nazree, Derman, Dr.
2
Mohd Mustafa Al-Bakri, Abdullah
2
Sandu, A.V.
1
Mohd Arif Anuar, Mohd Salleh
1
Mohd Mustafa Al Bakri, Abdullah
.
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Subject
4
Electroless copper
2
Copper matrix composites
2
Silicon carbide particles
2
Thermal expansion
1
Advanced packaging materials
.
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Date issued
2
2014
2
2013
1
2010