Temperature oriented design of an amplifier using submicron VLSI

Abstract

In recent trends various steps like logic optimization partitioning, floorplanning, placement and routing are used for design of any VLSI circuits. Among the above steps floor planning and placement play an important role in integrated circuit design. A set of components in a circuit which are called as modules or blocks are connected through interconnections called as ‘wires’. Floorplanning and placement is used to reduce the total area, size, power, temperature and cost of any circuit design. Various computational techniques are used to calculate and minimize the above parameters. Single IC consists of various Processing Elements (PE’s), which works on various voltage ranges. Due to this the IC power consumption increases, thereby temperature of the chip also increases. The main goal of this paper is to focus on calculation of area and power of any complicated VLSI circuit and to show Microwind simulation output for future design of any complicated circuits for various temperature ranges. The Submicron Technology is widely used for design of any analog circuits in Microwind.