Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/2007
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dc.contributor.authorZarimawaty Zailan-
dc.date.accessioned2008-09-09T05:29:21Z-
dc.date.available2008-09-09T05:29:21Z-
dc.date.issued2008-04-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/2007-
dc.descriptionAccess is limited to UniMAP community.en_US
dc.description.abstractThis paper I want to describe the reliability study of the effect of different dielectric materials for ultrathin oxide. The alternative high–k gate dielectrics are to provide a substantially thicker (physical thickness) for an improved performance according to increase permittivity, physical thickness characteristic and reduced leakage current. Design considerations for ultrathin gate oxide MOSFET devices are presented. Based on simulation and theory background it is shown that the most important parameters are the type of dielectrics materials and deposit thickness of dielectric materials. Experimental evidence for ultrathin gate oxide has been presented.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.subjectDielectricsen_US
dc.subjectSilicon oxide filmsen_US
dc.subjectSemiconductorsen_US
dc.subjectUltrathin oxideen_US
dc.subjectLower leakage currenten_US
dc.subjectHigh-k materialsen_US
dc.subjectIntegrated circuitsen_US
dc.subjectMetal Oxide Semiconductor Field Effect Transistor (MOSFET)en_US
dc.titleEffect of different dielectric materials for Ultrathin Oxideen_US
dc.typeLearning Objecten_US
dc.contributor.advisorMohd Hafiz Ismail (Advisor)en_US
dc.publisher.departmentSchool of Microelectronic Engineeringen_US
Appears in Collections:School of Microelectronic Engineering (FYP)

Files in This Item:
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Abstract, Acknowledgment.pdf156.15 kBAdobe PDFView/Open
Conclusion.pdf89.92 kBAdobe PDFView/Open
Introduction.pdf99.67 kBAdobe PDFView/Open
Literature review.pdf182.98 kBAdobe PDFView/Open
Methodology.pdf115.03 kBAdobe PDFView/Open
References and appendix.pdf325.63 kBAdobe PDFView/Open
Results and discussion.pdf228.96 kBAdobe PDFView/Open


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