Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/1931
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dc.contributor.authorHafizal Hafiz Sarjoni-
dc.date.accessioned2008-09-03T08:24:22Z-
dc.date.available2008-09-03T08:24:22Z-
dc.date.issued2007-03-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/1931-
dc.description.abstractDevice isolation is one of the most important technology features towards the realization of very large scale CMOS device integration. Since the early days of semiconductor industry, LOCOS isolation has been the major isolation scheme. However, one of it is major drawback is the oxide encroachment, or so called, bird’s beak beneath under active areas which limits its application in deep sub-micron CMOS technology. This project investigates the use of modified LOCOS structures for example Poly Buffered LOCOS (PBL) and Fully Recessed LOCOS as a bird’s beak suppressing technique. It was found that, Poly Buffered LOCOS and Fully Recessed LOCOS structures, have been dramatically reduce the oxide encroachment beneath the active areas.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.subjectCMOS deviceen_US
dc.subjectConventional Local Oxidation (LOCOS)en_US
dc.subjectMetal oxide semiconductors, Complementaryen_US
dc.subjectSilicon dioxideen_US
dc.subjectSemiconductor engineeringen_US
dc.subjectPad oxideen_US
dc.titleStudy the effect of bird’s beak on Fully Recessed LOCOS and Poly Buffered LOCOS using 2 different pad Oxideen_US
dc.typeLearning Objecten_US
dc.contributor.advisorZaliman Sauli, P.M. (Advisor)en_US
dc.publisher.departmentSchool of Microelectronic Engineeringen_US
Appears in Collections:School of Microelectronic Engineering (FYP)

Files in This Item:
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Abstract, Acknowledgment.pdf105.05 kBAdobe PDFView/Open
Conclusion.pdf22.88 kBAdobe PDFView/Open
Introduction.pdf42.68 kBAdobe PDFView/Open
Literature review.pdf241.33 kBAdobe PDFView/Open
Methodology.pdf114.3 kBAdobe PDFView/Open
References and appendix.pdf13.99 kBAdobe PDFView/Open
Results and discussion.pdf783.84 kBAdobe PDFView/Open


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