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DC Field | Value | Language |
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dc.contributor.author | Lin-Ngee, Ho | - |
dc.contributor.author | Teng, Fei Wu | - |
dc.contributor.author | Nishikawa, Hiroshi | - |
dc.contributor.author | Takemoto, Tadashi | - |
dc.contributor.author | Miyake, Koichi | - |
dc.contributor.author | Fujita, Masakazu | - |
dc.contributor.author | Ota, Koyu | - |
dc.date.accessioned | 2011-07-14T01:43:14Z | - |
dc.date.available | 2011-07-14T01:43:14Z | - |
dc.date.issued | 2011 | - |
dc.identifier.citation | Journals of Materials Science: Materials in Electronics, vol. 22 (7), 2011, pages 735-740 | en_US |
dc.identifier.issn | 0957-4522 | - |
dc.identifier.uri | http://www.springerlink.com/content/g4w54628l0428232/fulltext.pdf | - |
dc.identifier.uri | http://dspace.unimap.edu.my/123456789/13151 | - |
dc.description | Link to publisher's homepage at http://www.springerlink.com/ | en_US |
dc.description.abstract | The thermal stability and electrical reliability of electrically conductive adhesives (ECAs) filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%), respectively, were studied by comparing their electrical resistivity under high temperature exposure at 125 and 85 °C/85% RH for 1,000 h. Results showed that the Cu-Ag filled ECAs were superior to Cu-Mg filled ECAs in terms of thermal stability during aging under high temperature exposure and high humidity condition. A final resistivity on the order of 10-4 -.cm could be maintained for Cu-Ag filled ECAs after aging at 125 °C for 1,000 h. Cu-Mg filled ECAs showed relatively high electrical resistivity compared to Cu-Ag filled ECAs. Resistivity of Cu-Mg filled ECAs increased rapidly over time during high temperature exposure at 125 °C except for Cu-0.5 at.% Mg filled ECA which was thermally stable after 400 h of aging. The ECAs in this study could withstand high temperature exposure at 125 °C better than aging under a combination of elevated temperature and high humidity at 85 °C/85% RH. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Springer | en_US |
dc.subject | Electrical reliability | en_US |
dc.subject | Copper alloy filler | en_US |
dc.subject | Cu-Ag | en_US |
dc.title | Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives | en_US |
dc.type | Article | en_US |
dc.contributor.url | holingee@yahoo.com | en_US |
Appears in Collections: | School of Materials Engineering (Articles) |
Files in This Item:
File | Description | Size | Format | |
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Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesi.pdf | 40.1 kB | Adobe PDF | View/Open |
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