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Results 1-6 of 6 (Search time: 0.0 seconds).
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Issue Date
Title
Author(s)
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Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
Norainiza, Saud, Dr.
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Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
Nurul Razliana, Abdul Razak
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The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
Norainiza, Saud, Dr.
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Hot air solder levelling (HASL) process parameters optimization for SN100CL
Che Mohd Ruzaidi, Ghazali, Assoc. Prof.
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Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
Norainiza, Saud, Dr.
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Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
Norainiza, Saud, Dr.
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Author
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Fatin Afeeqa, Mohd Sobri
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Mohd Izrul Izwan, Ramli
1
Nisrin, Adli
1
Norhayanti, Mohd Nasir
1
Sayyidah Amnah, Musa
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Subject
2
Powder Metallurgy
2
Solders
1
Atmospheric temperature
1
Carbon composites
1
Composite solder
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