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Issue Date	Title	Author(s)
2006	Test chip and substrate design for flip chip microelectronic package thermal measurements	Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; teck.joo.goh@intel.com; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2004	Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization	Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan; teck.joo.goh@intel.com; knseetharamu@hotmail.com; gaquadir@unimap.edu.my

Showing results 1 to 2 of 2