UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Browsing by Author ramani@perlis.uitm.edu.my
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
| 2013 | Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints | Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Mayappan, Ramani; Noor Farhani, Mohd Alui; arifanuar@unimap.edu.my; niknoriman@unimap.edu.my; ramani@perlis.uitm.edu.my |
| 9-Jun-2010 | Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging | Ramani, Mayappan; Rosyaini, A. Zaman; Zalina, Z. Abidin; Asmawati@FatinNajihah, Alias; Mohd N., Derman; ramani@perlis.uitm.edu.my |
| Dec-2012 | Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging | Noor Asikin, Ab Ghani; Iziana, Yahya; Mohd Arif Anuar, Mohd Salleh; Saidatulakmar, Shamsuddin; Zainal Arifin, Ahmad; Ramani, Mayappan; asikinabghani@gmail.com; izianayahya@gmail.com; arifanuar@unimap.edu.my; saida@perlis.uitm.edu.my; zainal@eng.usm.my; ramani@perlis.uitm.edu.my |
| 2013 | Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder | Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui; arifanuar@unimap.edu.my; niknoriman@unimap.edu.my; rafezi@unimap.edu.my; ramani@perlis.uitm.edu.my |
