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Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
2006Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue lifeLee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Goh, Teck Joo; ishak@eng.usm.my; gaquadir@unimap.edu.my
2005Application of artificial neural network for fatigue life predictionIshak, Abdul Azid, Dr.; Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; ishak@eng.usm.my; leekoroon@yahoo.com; oku337@hotmail.com; knramu@eng.usm.my; gaquadir@unimap.edu.my
2004Flow analysis for flip chip underfilling process using characteristic based split methodKulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my
2006Numerical simulation of underfill encapsulation process based on characteritsic split methodKulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; vmkulkarni1@yahoo.com; knseetharamu@hotmail.com; ishak@eng.usm.my; paa_iitm@yahoo.co.in; gaquadir@unimap.edu.my
2005Optimization of fins used in electronic packagingOng, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo; leekoroon@yahoo.com; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my
2002Optimization of PCB component placement using genetic algorithmJeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my
2005Optimization of thermal resistance of stacked micro-channel using genetic algorithmsJeevan, Kanesan; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com; ishak@eng.usm.my
2005Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithmsJeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com; ishak@eng.usm.my
Showing results 1 to 8 of 8