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Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
May-2011Effect of different copper fillers on the electrical resistivity of conductive adhesivesLi-Ngee, Ho; Nishikawa, Hiroshi; Takemoto, Tadashi; holingee@yahoo.com
1-Dec-2009Electrical properties and thermal stability of Cu-P containing electrically conductive adhesivesLi-Ngee, Ho; Hiroshi, Nishikawa; Tadashi, Takemoto; holingee@yahoo.com
2011Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesivesLin-Ngee, Ho; Teng, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu; holingee@yahoo.com
Jun-2012Enhanced photocatalytic activity of fish scale loaded TiO 2 composites under solar light irradiationHo, Li Ngee; Ong, Soon-An; Hakimah, Osman; Chong, Fong-Mun; holingee@yahoo.com
Jun-2013Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesivesHo, Li Ngee, Dr.; Hiroshi, Nishikawa; holingee@yahoo.com; lnho@unimap.edu.my
Sep-2012Photocatalytic degradation of reactive black 5 by fish scale-loaded TiO 2 compositesHo, Li Ngee; Ong, Soon-An; Yee, Lin See; holingee@yahoo.com
Nov-2013Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agentsHo, Li Ngee, Dr.; Teng, Fei Wu; Hiroshi, Nishikawa; holingee@yahoo.com; lnho@unimap.edu.my; nisikawa@jwri.osaka-u.ac.jp
Sep-2012Surfactant-free synthesis of copper particles for electrically conductive adhesive applicationsHo, Li Ngee; Nishikawa, Hiroshi; holingee@yahoo.com
Showing results 1 to 8 of 8