UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Browsing by Author clgan_pgg@yahoo.com
Showing results 1 to 5 of 5
| Issue Date | Title | Author(s) |
| Nov-2013 | Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging | Gan, Chong Leong; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; uda@unimap.edu.my |
| Oct-2014 | Influence of shear strength on long term biased humidity reliability of Cu ball bonds | Chong, Leong Gan; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; uda@unimap.edu.my |
| 2013 | Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging | Chong, Leong Gan; Uda, Hashim, Prof. Dr.; chong-leong.gan@spansion.com; clgan_pgg@yahoo.com; uda@unimap.edu.my |
| Aug-2013 | Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package | Chong, Leong Gan; Uda; chong-leong.gan@spansion.com; clgan_pgg@yahoo.com; uda@unimap.edu.my |
| 2013 | Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; mflim@yahoo.com; gchongleong@gmail.com; chong-leong.gan@spansion.com; uda@unimap.edu.my |
