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Browsing by Author azmikamardin@unimap.edu.my
Showing results 1 to 6 of 6
| Issue Date | Title | Author(s) |
| 2014 | Cu-SiCp composites as advanced electronic packaging materials | Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V.; azmikamardin@unimap.edu.my |
| 1-Dec-2009 | The effects of autocatalyst copper coating of SiCp on the microstructure of CuSiCp composites | Azmi, Kamardin; Mohd Nazree, Derman; Shaiful Rizam Shamsudin; Mazlee, Mohd Noor; J.A.H., Iqwan; azmikamardin@unimap.edu.my |
| 2013 | Metallurgical failure analysis of a closed recirculation system water cooling pipe | Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Azmi, Kamardin; Noor Hamidi, Mohd Noor; Hafizan, Hassan; arifanuar@unimap.edu.my; azmikamardin@unimap.edu.my |
| 2013 | Synthesis and characterization of electroless copper coated SiC particles | Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr.; azmikamardin@unimap.edu.my; arifanuar@unimap.edu.my; nazree@unimap.edu.my |
| Jan-2014 | Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique | Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Sandu, A.V.; azmikamardin@unimap.edu.my |
| 2013 | The thermal expansion behaviors of Cu-SiCp composites | Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah; azmikamardin@unimap.edu.my; nazree@unimap.edu.my; mustafa_albakri@unimap.edu.my |
