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Browsing by Author Yap, Boon Kar, Dr.

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Issue DateTitleAuthor(s)
2013Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUSYap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; kbyap@uniten.edu.my; zaliman@unimap.edu.my; vc.sundres@gmail.com
2013Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyYap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan; kbyap@uniten.edu.my; zaliman@unimap.edu.my; sundres@gmail.com
Showing results 1 to 2 of 2