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Browsing by Author Teng, Fei Wu

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Issue DateTitleAuthor(s)
2011Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesivesLin-Ngee, Ho; Teng, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu; holingee@yahoo.com
Nov-2013Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agentsHo, Li Ngee, Dr.; Teng, Fei Wu; Hiroshi, Nishikawa; holingee@yahoo.com; lnho@unimap.edu.my; nisikawa@jwri.osaka-u.ac.jp
Showing results 1 to 2 of 2