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Browsing by Author Mayappan, Ramani
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
| 12-Apr-2012 | Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method | Iziana, Yahya; Noor Asikin, Ab Ghani; Mohd Arif Anuar, Mohd Salleh; Hamidi, Abd Hamid; Zainal Arifin, Ahmad; Mayappan, Ramani; izianayahya@gmail.com |
| 2013 | Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints | Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Mayappan, Ramani; Noor Farhani, Mohd Alui; arifanuar@unimap.edu.my; niknoriman@unimap.edu.my; ramani@perlis.uitm.edu.my |
| 2013 | Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder | Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui; arifanuar@unimap.edu.my; niknoriman@unimap.edu.my; rafezi@unimap.edu.my; ramani@perlis.uitm.edu.my |
