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Browsing by Author Ibrahim, Ahmad
Showing results 1 to 7 of 7
Issue Date | Title | Author(s) |
2007 | The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition | Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar |
2007 | Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process | Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad |
2012 | Dicing die attach film for 3D stacked die QFN packages | Shahrum, Abdullah; S., Mohd Yusof; Ibrahim, Ahmad; Azman, Jalar; Ruslizam, Daud, Dr.; shahrum@eng.ukm.my; azmn@ukm.my; ruslizam@unimap.edu.my |
6-Dec-2005 | The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim |
Sep-2006 | The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim |
28-Jun-2010 | A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility | Mohd Azizi, Chik; Ve, Chun Yung; Balakrishna, Puvaneswaran; Uda, Hashim, Prof. Dr.; Ibrahim, Ahmad; Bashir, Mohamad |
2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar |