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Browsing by Author Hiroshi, Nishikawa

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Issue DateTitleAuthor(s)
Sep-2014Copper-filled electrically conductive adhesives with enhanced shear strengthHo, Li Ngee, Dr.; Hiroshi, Nishikawa; lnho@unimap.edu.my; nisikawa@jwri.osaka-u.ac.jp
1-Dec-2009Electrical properties and thermal stability of Cu-P containing electrically conductive adhesivesLi-Ngee, Ho; Hiroshi, Nishikawa; Tadashi, Takemoto; holingee@yahoo.com
Jun-2013Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesivesHo, Li Ngee, Dr.; Hiroshi, Nishikawa; holingee@yahoo.com; lnho@unimap.edu.my
Nov-2013Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agentsHo, Li Ngee, Dr.; Teng, Fei Wu; Hiroshi, Nishikawa; holingee@yahoo.com; lnho@unimap.edu.my; nisikawa@jwri.osaka-u.ac.jp
Showing results 1 to 4 of 4