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Browsing by Author Chong, Leong Gan

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Issue Date	Title	Author(s)
Jun-2013	Extended reliability of gold and copper ball bonds in microelectronic packaging	Chong, Leong Gan; Classe, Francis; Bak, Lee Chan; Uda, Hashim, Prof. Dr.; chong-leong.gan@spansion.com; uda@unimap.edu.my
Oct-2014	Influence of shear strength on long term biased humidity reliability of Cu ball bonds	Chong, Leong Gan; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; uda@unimap.edu.my
2013	Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging	Chong, Leong Gan; Uda, Hashim, Prof. Dr.; chong-leong.gan@spansion.com; clgan_pgg@yahoo.com; uda@unimap.edu.my
Aug-2013	Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package	Chong, Leong Gan; Uda; chong-leong.gan@spansion.com; clgan_pgg@yahoo.com; uda@unimap.edu.my
2013	Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array	Chong, Leong Gan; Classe, Francis; Uda, Hashim, Prof. Dr.; uda@unimap.edu.my; chong-leong.gan@spansion.com
2013	Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging	Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; mflim@yahoo.com; gchongleong@gmail.com; chong-leong.gan@spansion.com; uda@unimap.edu.my

Showing results 1 to 6 of 6