UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Browsing by Author Bak, Lee Chan
Showing results 1 to 2 of 2
| Issue Date | Title | Author(s) |
| Jun-2013 | Extended reliability of gold and copper ball bonds in microelectronic packaging | Chong, Leong Gan; Classe, Francis; Bak, Lee Chan; Uda, Hashim, Prof. Dr.; chong-leong.gan@spansion.com; uda@unimap.edu.my |
| 2013 | Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; mflim@yahoo.com; gchongleong@gmail.com; chong-leong.gan@spansion.com; uda@unimap.edu.my |
