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Browsing by Author Azman, Jalar
Showing results 1 to 13 of 13
Issue Date | Title | Author(s) |
2007 | The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition | Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar |
2007 | Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process | Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad |
2012 | Dicing die attach film for 3D stacked die QFN packages | Shahrum, Abdullah; S., Mohd Yusof; Ibrahim, Ahmad; Azman, Jalar; Ruslizam, Daud, Dr.; shahrum@eng.ukm.my; azmn@ukm.my; ruslizam@unimap.edu.my |
1-Dec-2009 | Effect of different filler ( Er5356 and Er4043) toward mechanical and microstructure properties of the joint gas metal arc welding Aa6061-T6 | A.A.A., Aziz; M.F.A, Ibrahim; Azman, Jalar; Syarif Junaidi, S Djalil; N.M., Rashdi |
6-Dec-2005 | The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim |
Sep-2006 | The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim |
1-Dec-2009 | The influence of filler metal on porosity formation of AA6061 aluminium alloy joints | M.F.A, Ibrahim; A.A.A., Aziz; Azman, Jalar; J., Syariff; M.N., Rashdi |
1-Dec-2009 | Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders | Norainiza, Saud; Azman, Jalar; intanniza@yahoo.com |
1-Dec-2009 | Production of Al/Al2O3p Metal Matrix Composites (MMC) by Semisolid metal processing method | H., Budiman; Mohd. Zaidi, Omar; Azman, Jalar |
1-Dec-2009 | Quantitative stereology for fractal dimensions of Aluminum Alloy AA6061 and AA6063 | N. E., Salehudin; Azman, Jalar; Abd. Razak Daud, Daud; missellereez@yahoo.com |
1-Dec-2009 | Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package | Azman, Jalar; Saidatul Azura, Radzi; M.A. A., Hamid |
2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar |
1-Dec-2009 | Water vapour effects on chromia forming alloys during cyclic oxidation | N.K., Othman; Azman, Jalar; N., Othman; insan@ukm.my |