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Browsing by Author Sandu, A.V.
Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
2014 | Cu-SiCp composites as advanced electronic packaging materials | Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V.; azmikamardin@unimap.edu.my |
Jan-2014 | Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique | Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Sandu, A.V.; azmikamardin@unimap.edu.my |