UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Browsing by Author E., K. Ng
Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
2012 | Technical barriers and development of Cu wirebonding in nanoelectronics device packaging | C., L. Gan; E., K. Ng; B., L. Chan; Uda, Hashim, Prof. Dr.; F., C. Classe; clgan pgg@yahoo.com |
2013 | Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr.; clgan_pgg@yahoo.com; mflim@yahoo.com; gchongleong@gmail.com; chong-leong.gan@spansion.com; uda@unimap.edu.my |